1.Introduction
2.Background
i. PCB Structure, Composition, Uses, Properties
-	heterogeneous 
ii. Brief Overview of Current Practises
-	Flow diagram/words to describe process in general
iii. Drivers
a.	Price
- Precious metals is main driver due to high prices
		b. Resource Depletion 
		c. Social Responsibility
		d. Increased disposal rates
- [“The rapid innovation in technology has resulted in availability of cheaper and better electronic products in the market making products obsolete faster and shortening the product life”] 
		e. Social Responsibility
		f. Legislation
3. PCB Recycling
	i. Pretreatment
		a. Composition Analysis 
-	Techniques??
-	Identify reusable parts 
-	AAS, ICP-AES
b.	Disassembly/Dismantling 
-	They use lasers and stuff
-	Reusable parts are shipped back to the market or OEM
-	Removal of hazardous components
-	Generally Manual (not economical)
-	Research into auto and semi auto (Austria full scale)

	ii. Separation/Concentration
-	Shredding and crushing to reduce particle size ( find the optimum size)
-	Separation methods
o	Size
o	Density
o	Electrostatic
o	Eddy (Al)
o	Magnetic
o	Gravitational
	iii. Refining/Recovering
a.	Hydrometallurgy
-	Most metals are recovered at high efficiency
-	Environmental impacts – effluents
-	Different Chemicals used at different stages
o	Fluoroboric acid for Solder
o	Sulphuric/Nitric for Copper
o	Cyanide for Gold (?)
	Thiourea
	Thiosulphate
	Halides
o	Alternatives
-	For Metal/Non-Metal mixes  use Leaching
-	For Metallic mixes use electrochemical processes
b.	Pyrometallurgy
-	Smelting to recover copper, tin and lead
• waster generation: slag and ash, volume waste
• environmental impacts: global warming, acidification,  photochemical ozone creation, and eutrophication
• resource draw: lignite, natural gas, crude oil, coal, aluminum, iron, and zinc

-	Air Pollution 
-	Flame retardant properties of matrix
-	Potential use of oil and gas effluents for fuelling system




What about substrate? Ceramics, Glass, Polymers! Out of scope?